Semiconductor chip packaging

Features

• High temperature resistance •

• Excellent softness, can be bonded to various surfaces •
• Excellent chemical resistance •

• Self-cleaning property •

• Excellent mechanical toughness •

ETFE film has excellent chemical resistance and non-stick properties, so it can be used as FPCB thermal compression release film, chip packaging and LED lamp bead packaging release film.

Type

ETFE/FEP/PFA Film
 

Application

Electronic devises Semiconductor chip packaging, printed circuit boards, etc.