Q M T
Qianmi Technology
Applications Areas
Ensure that the products produced have good appearance quality and accurate specifications and sizes
is widely used in Architecture
Industry and other areas
Industry Information
ETFE curved roof- The Annaheim Regional Transportation Intermodal Center
The Annaheim Regional Transportation Intermodal Center (ARTIC) sets a new precedent for the transportation hub, and transforms a key area of the city into a friendly destination for pedestrians and bicycles. ARTIC connects more than ten types of transportation in an efficient and flexible facility, including future high -speed railways, and provides retail, characteristic catering and community space in this area that was once defined by automobiles.
2024-10-15
FEP fluoroplastic film
1. Non-stick and thermal sealing with F46,
2. Below the melting point, not wetting with any object.
3. It has good adhesion with F4 and metals. Its own adhesion (heat seal) to high and low temperature-200--200 ° C;
2024-10-15
Fujian Zhangpu County Cultural and Sports Center Stadium Project ETFE membrane structure Began to install
Zhangpu County Cultural and Sports Center Stadium Project is located in Zhangpu County, Zhangzhou City, Fujian Province. It is close to Chaoyang Avenue with a total construction area of 26,800 square meters and 15,000 seats.
2024-10-15
Suzhou Qianmi Technology Co., Ltd. is a very professional and innovative enterprise in the field of fluoropolymer film. The company's core team members are senior professionals in the industry. With rich experience and in -depth professional knowledge, they have continuously explored the performance improvement and application expansion of the fluoropolymer film. The company has introduced a customized high -performance fluoroplastic film production line to ensure that it can efficiently and stably produce high -quality high -performance fluoroplastic film to meet the strict requirements of products for different customers. At present, products are widely used in high -frequency communication, aerospace, lightweight photovoltaic, new energy, semiconductor chip packaging and other fields.
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